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EPOXY MOLDING COMPOUNDS FOR SEMICONDUCTOR ENCAPSULATION.REINHART J.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 8; PP. 29-31Article

RESOLUTION OF THE GOLD WIRE GRAIN GROWTH FAILURE MECHANISM IN PLASTIC ENCAPSULATED MICROELECTRONIC DEVICESJAMES HK.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 370-374; BIBL. 6 REF.Article

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DEVELOPMENTS LIKELY TO IMPROVE THE RELIABILITY OF PLASTIC ENCAPSULATED DEVICES.JONES RO.1978; MICROELECTRON. AND RELIABIL.; GBR; DA. 1978; VOL. 17; NO 2; PP. 273-278; BIBL. 2 REF.Article

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PRESSURE DEFLASHER CUTS POWER COSTS BY 80%1979; INSULAT. CIRCUITS; USA; DA. 1979; VOL. 25; NO 11; PP. 11Article

BOITIERS CERAMIQUE OU PLASTIQUE: QUELLE EST LEUR FIABILITE.BICKLEY J.1981; ELECTRON. IND.; FRA; DA. 1981; NO 9; PP. 37-39Article

THERMAL STRESS ANALYSIS OF COMPOSITE ENCAPSULANTS WITH A SPHERICAL ADHESIVE SURFACEJORDAN AS; BERKSTRESSER GW.1980; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1980; VOL. 20; NO 4; PP. 495-499; BIBL. 7 REF.Article

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PRUEFVERFAHREN ZUR FEUCHTEBESTAENDIGKEIT PLASTUMHUELLTER IS = METHODE DE CONTROLE DE LA TENUE A L'HUMIDITE DES CIRCUITS INTEGRES SOUS PLASTIQUETHOMAS J.1978; RADIO FERNSEHEN ELEKTRON.; DDR; DA. 1978; VOL. 27; NO 6; PP. 388-390Article